Event Overview:

The AM3D conference was started to highlight the product design, manufacturing, and product validation challenges associated with the industrial adoption of additive manufacturing for the engineering community. This event assembles the leading technology developers, service providers, product designer and manufactures (users) to exchange technical knowledge on the adoption and application of additive manufacturing. AM3D is co-located with International Design Engineering Technical Conferences and Computers and Information in Engineering Conference (IDETC/CIE) , which features cutting-edge Design Engineering research and development technologies which will change the future of product design and manufacturing. Conference attendees may attend technical session in either conference without any additional cost.

Discover the ENGINEERING behind Additive Manufacturing & 3D printing.

ASME's Additive Manufacturing + 3D Printing Conference & Expo (AM3D), is designed specifically for the Engineering community. We've customized a program around the product development process to highlight issues, challenges, and solutions associated with every step of the AM lifecycle.

Attendee Information:
 Why Attend AM3D?

    Applications Spanning Multiple Industries: A cross disciplinary review of AM in Aerospace, Automotive, Medical Device, and Manufacturing applications will help optimize your AM strategy around your particular technical requirements.
    World-Class Interactive Sessions & Networking: Establish valuable relationships and exchange ideas with leading experts from industry, government and academia who share breakthroughs and provide solutions to complex business challenges in AM design, material advancements, process validation, and inspection technologies.
    In-Depth Agenda & Strong Speaker Faculty: The program focuses on complex technical challenges, case studies, and demonstrations that are advancing the AM space and provide you the means to overcome AM myths and develop the methods required to be disruptive with AM.
    Learn Design for AM: Upgrade your skill set in sessions that teach you how to design for AM.

Exhibitor Information:

(Meet clients/prospects primarily from industry)
AM3D convenes mid to senior level technical professionals that work in R&D, design, manufacturing, supply chain and quality control from a wide array of companies for four days of workshops, technical sessions, panel discussion and social/networking events.

5 Critical Reasons For Sponsoring and Exhibiting at AM3D/IDETC/CIE:

Exposure:  As we continue to market and promote the excellent collaboration between AM3D and IDETC/CIE, this will automatically include the identification and highlight of our sponsors and exhibitors.  Further exposure will be implemented onsite at the conference via participation by press and media outlets.
Lead Generation:  Gain full exposure to 2,000 highly qualified attendees comprised of leading universities, government institutes and industry.
Innovation:  IDET/CIE is the world’s leading design engineering research conference, debuting cutting-edge engineering technologies that address some of today’s most complex engineering challenges.
Engagement:  Connect with the global Design Engineering community who can help you find solutions, provide opportunities for collaboration, or meet your engineering recruitment needs.
Philanthropy:  ASME is a not-for-profit membership organization that enables collaboration, knowledge sharing, career enrichment, and skills development across all engineering disciplines, toward a goal of helping the global engineering community develop solutions to benefit lives and livelihoods.

About ASME:

ASME is a not-for-profit membership organization that enables collaboration, knowledge sharing, career enrichment, and skills development across all engineering disciplines, toward a goal of helping the global engineering community develop solutions to benefit lives and livelihoods. Founded in 1880 by a small group of leading industrialists, ASME has grown through the decades to include more than 140,000 members in 151 countries.

Co-located with IDETC/CIE