Designed for trade association, exhibitors, academic institutions and speakers, List and promote your online events
Largest database of verified shows since 2015, Detailed profiles of verified trade shows, conferences and consumer shows. Create your event and attract attendees and exhibitiors, Listing tools for verification, institution and corporation.
Connect with verified event organizers, Listing and RFP tools for verified venue operators.Size events by verified attendee and exhibitor count database
Research verified b2b events by industry and profession, Review virtual exhibitor showcase. Create Profile. Connect with verified event organizers and exhibitors.
Search 900k verified exhibitor database organizedby 2,000+ events since 2018.
Overview
The Electronic Components and Technology Conference is the premier semiconductor packaging conference.
Why Attend – 2023
The Conference is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used.
Special papers presented at the conference will be awarded the Intel Best Student Paper Award and best and outstanding paper awards.
The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.
Why Exhibit – 2023
Exhibitors will get an opportunity to showcase their products and services to a target audience. The conference offers an unparalleled opportunity to build relationships with more than 1,700 individuals and organizations committed to driving innovation in semiconductor packaging.
Organizer
The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.
Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences, and the maintenance of a high professional standing among its members and others and with special attention of such aims within the field of interest of the Society.
Source: Event Website
Source : Event Website
Attendees
Exhibitors
Register
| Event Name | City | State | Atendance | Exhibitors | Date |
|---|---|---|---|---|---|
| IEEE Electronic Components & Technology Conference - ECTC 2025 | Denver | Colorado | estimated |
estimated |
May 27, 2025 |
| IEEE Electronic Components & Technology Conference 2024 - ECTC | Denver | Colorado | estimated |
verified |
May 28, 2024 |
| IEEE Electronic Components & Technology Conference - ECTC | Orlando | Florida | estimated |
verified |
May 30, 2023 |
| Event Name | City | State | Atendance | Exhibitors | Date |
|---|---|---|---|---|---|
| 2024 IEEE International Conference on Consumer Electronics (ICCE) | Las Vegas | Nevada | estimated |
verified |
Jan 06, 2024 |
| Consumer Electronics Show 2024 | Las Vegas | Nevada | estimated |
verified |
Jan 09, 2024 |
| 2024 AHR EXPO - International Air-Conditioning, Heating, Refrigerating Exposition | Chicago | Illinois | estimated |
verified |
Jan 22, 2024 |
| Imaging USA 2024 | Louisville | Kentucky | estimated |
verified |
Jan 28, 2024 |
| Pan Pacific Microelectronics 2024 | Waialua | Hawaii | estimated |
verified |
Jan 29, 2024 |
